March 29, 2002
			Manabu Bonkohara
			Tokyo Institute of Technology Yokohama Venture Plaza 4259-3 Nagatsuta-cho, Midori-ku Yokohama, Kanagawa 226-8510 Japan
			ZyCube Sendai Lab.
			34,000,000 Japanese Yen
			3D LSI Tehcnology Development and Application Development of 3D LSI technology-applied Chip for Partners Optimization of 3D LSI technology process for Partner's application Manufacturing of 3D LSI technology-applied ASSP chip