1968 Material Engineering, Osaka Univ. Japan 1968 NEC IC Div. Invented Au Superfine-wiring technology, which is current defact-standard, for Automatic LSI bonder machine 1992 Director of NEC Packaging Technology Research Gr. Developed TAB technology for super computer, and TCP technology for consumer electronics. 1994 Project Director of NEC New Packaging Technology Research Gr. Developed Bearchip MCM Tech (LLC Tech) for Note PC & PDA, and Accumulated Memory Packaging Tech for Aero-Space ALOS Recorder 1999 Director of Electronics System Integration Technology Research Department National Project : Association of Super-Advanced Electronics Technologies (ASET) 2004 ZyCube President / CEO Technical Advisor of ASET 1992-2002 JIEP 1999-2004 The Electronics and related Industries Committee of the Electronics System Integration Advanced Techinical Promontory 2002- Member of ECS-ISTC
	1974 Doctor of Electronic Engineering, Tohoku Univ. Japan 1974 Hitachi Ltd., Research Center Researched DRAM process/Device Tech. Invented Stacked Capacitor DRAM. 1985 Xerox Palo Alto Research Center Researched sub-micron device, TFT, and digital/analog LSI advanced design 1988 Professor of Integrated System Research Center, Hiroshima Univ. Researched Superfine Semiconductor device, ALIC, optical interconnection and so on 1994 Professor of Intelligent Machine Engineering, Tohoku Univ. 1995 Professor of Intelligent Machine Engineering, Graduate School, Tohoku Univ. Chairman of Venture Lab, Tohoku Univ. Researching 3D LSI Tech. 2003 Professor of Bioengineering and Robotics, Graduate School of Engineering, Tohoku Univ. 2004 ZyCube CTO 1992 SSDM Award 1996 IEEE Cledo Brunetti Award 1997 IEEE Fellow Award 2002 Minister of Science and Technology Agency Award 2006 IEEE Jun-ichi Nishizawa Medal "Physics of VLSI Device" (Maruzen) "Sub-micron Technology I, II" (Maruzen)