 |
Jul.14.2010. |
|
Dr. M. Motoyoshi presented a paper of the TSV Technology Application, at
the JIEP seminar. |
|
|
|
|
|
May.20.2010. |
|
Dr. M. Bonkohara presented a paper of the 3D packaging application using
TSV, at JJTTA. |
|
|
|
|
|
Apr.01.2010. |
|
ZyCube and EPWorks (in Korea) sign agreement to the TSV process module
foundry business. |
|
|
|
|
|
Apr.01.2010. |
|
ZyCube and a vacuum equipments maker sign agreement to the 3D process consulting deal. |
|
|
|
|
|
Apr.01.2010. |
|
ZyCube CTO, Prof. M. Koyanagi , assumed the professor of Niche at Tohoku
university. |
|
|
|
|
|
Mar.31.2010. |
|
ZyCube completed the 2004 national project (Stacked memory technology) delegated by NEDO. |
|
|
|
|
|
Feb.23.2010. |
|
ZyCube CTO, Prof. M. Koyanagi , presented his "Retiring Talk"
at Tohoku university. |
|
|
|
|
|
Feb.22.2010. |
|
ZyCube presented our business activity at "MONOTSUKURI Forum in KANTOH". |
|
|
|
|
|
Jan.28.2010. |
|
Mr. H. Nakamura presented a paper on CMOS image sensors packaging technology,
at "Electronics Journal Technical Symposium". |
|
|
|
|
|
Dec.04.2009. |
|
Dr. M. Motoyoshi presented a paper of the 3D-LSI Imaging sensor technology trend, at "Japan 2009 SEMI Technology Symposium". |
|
|
|
|
|
Oct.14.2009. |
|
Dr. M. Motoyoshi presented a paper, "Current and future 3D-LSI processes
using TSV", at the meeting of "ISMP 2009 (International Symposium
on Microelectronics and Packaging 2009)", Seoul, Korea. |
|
|
|
|
|
Sep.27.2009. |
|
Dr. M. Motoyoshi presented a paper, "Requirements of test techniques
for 3D devices", at the meeting of "International 3D Systems
Integration Conference 2009", San Francisco, USA. |
|
|
|
|
|
Sep.01.2009. |
|
ZyCube achieved a 2009 national project of the 3D integration technology
for imaging sensors. |
|
|
|
|
|
.Apr.29.2009 |
|
Dr. M. Motoyoshi presented a paper, "Current and Future 3D-LSI using
TSV", at the meeting of "2009 VLS-TSA", Hsinchu, Taiwan. |
|
|
|
|
|
Apr.16.2009 |
|
Mr. H. Nakamura presented a paper, "The TSV Technology Application
for High Quality Image Sensors", at the meeting of "TSV Technology
Conference 2009", Tokyo Japan. |
|
|
|
|
|
Oct. 2, 2008
|
|
uLatest TSV Technologies and Application Developmentv presented in Jisso Forum
2008 |
|
|
|
|
|
Jul. 8, 2008 |
|
ZyCube names Makoto Motoyo President and Chief Executive Officer |
|
|
|
|
|
Nov 19, 2007 |
|
ZyCube headquarter moves to Yokohama |
|
|
|
|
|
Feb. 23, 2007 |
|
ZyCube exhibits "nano tech 2007 International Nanotechnology Exhibition
& Conference" (Tokyo Big site, Tokyo) |
|
|
|
|
|
Jan. 24, 2007 |
|
ZyCube and OKI sign agreement to commercialize image sensors for Wafer-level
CSP with buried interconnects |
|
|
|
|
|
Jan. 22, 2007 |
|
Oki, ZyCube prep packaging technology for image sensors (EE Times) |
|
|
|
|
