Date Media Title Jan 25, 2007 EETIMES Oki, ZyCube prep packaging technology for image sensors Dec 26, 2005 EETIMES 3-D chip vendor corrects course
	Date Title Dec. 06-08, 2006 ZyCube offers "Process Flow" chart to the exhibition booth of Sekisui Chemical at SEMICON Japan 2006 Dec. 06-08, 2006 ZyCube offers "Process Flow" chart and samples of "Wafer + Glass substrate" to the exhibition booth of Takatori at SEMICON Japan 2006 Jun 24, 2006 ZyCube CTO Mitsumasa Koyanagi, Tohoku University Professoor, wins 2006 IEEE Jun-ichi Nishizawa Medal Jun 13, 2006 President Manabu Monkohara speaks at Industrial Technology Research Institute in Taipei "3D Chip Stacking with Vertical interconnect" Jun 12, 2006 President Manabu Monkohara pays a courtesy visit on Taiwanese President Chen Shui-Bian Mar 24, 2006 Dr. Richard B. Dasher of Stanford University elected to ZyCube board of directors Sep 12-14, 2005 President Bonkohara has speech at The 12th Annual KGD Packaging and Test Workshop titled "The Early Stage Application of 3D LSI Stacking Technology -- ZyCube CSP for CMOS Image Sensor" May 16, 2005 President Bonkohara has speech at CAST 2005 titled "A new industrializing movement for 3D LSI stacking technology" May 12, 2005 CTO Koyanagi has speech at Novel Integration in Advanced Electronic Systems at Stanford University titled "Different approaches to 3D chips" Oct 04, 2004 Head office moves to Nihonbashi, Chuo-ku, Tokyo